Manufacturing
Advanced Packaging Market Analysis by Mordor Intelligence
The advanced packaging market size is expected to grow from USD 51.62 billion in 2025 to USD 57.46 billion in 2026 and is forecast […]
Tag: Advanced Packaging
Materials & Chemicals
NovoLINC Tackles Silicon Warpage Limits with High-Power Thermal Interface Milestone
As the semiconductor industry scales up multi-chip architectures and larger packages, managing heat dissipation has become an urgent mechanical problem. Modern advanced packaging combines […]
Equipment
SUSS MicroTec Enters Wafer Cleaning Market with GreenTec Solutions and GT200 System
SUSS MicroTec SE has announced its official entry into the wafer-level cleaning sector with the introduction of its GreenTec Solutions product line and its […]
Manufacturing
JEDEC Unveils First Industry Reliability Standard for Silicon Photonics Devices
JEDEC Solid State Technology Association has published ‘JESD264: Silicon Photonics Qualification and Reliability Requirements’, introducing the microelectronics industry’s first unified standard dedicated to testing […]
Equipment
Hamamatsu Develops All-in-One Failure Analysis Tool for Advanced Packages
The boom in artificial intelligence has created a major testing headache. As AI chips get faster and more capable, engineers are stacking multiple smaller […]
Manufacturing
LB Semicon Expands Power Chip Packaging Line in Gumi City
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon has signed a memorandum of understanding (MOU) with Gumi City to expand its […]
Packaging & Testing
Global Electronics Association and Fraunhofer Team Up to Scale Advanced Packaging
As traditional silicon scaling slows, advanced packaging has become the semiconductor sector’s most critical lever for delivering faster, smaller, and more power-efficient devices. To […]
Manufacturing
Singapore Launches ‘SG Semiconductor’ to Unify Fab Power, R&D, and Global Partnerships Under One Flag
For nearly sixty years, Singapore has steadily built itself into a cornerstone of the global electronics map. Today, the island nation produces one in […]
Packaging & Testing
UK Unveils Semiconductor Catapult to Secure Domestic Chip Supply
To secure critical supply chains and speed up the journey from lab research to market reality, the UK has officially launched the Semiconductor Catapult. […]
Equipment
Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips
The next generation of high-performance AI chips requires new cooling solutions. At Semicon Taiwan, TRUMPF is showcasing for the first time a new ultrashort-pulse […]