NY Creates Joins 12-Inch Mask Initiative for High-NA EUV
NY Creates (the New York Center for Research, Economic Advancement, Technology, Engineering, and Science) announced its inclusion in the 12-inch mask industry initiative, a […]
Category: Equipment
Samsung Electronics and ASML Expand Strategic Collaboration for Next-Generation Semiconductor Manufacturing
Samsung Electronics and ASML announced an expansion of their long-standing strategic partnership, deepening collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies […]
KAIST and Samsung Develop Durable Catalyst to Break Down Semiconductor Greenhouse Gas CF₄
A research team at the Korea Advanced Institute of Science and Technology (KAIST), working in collaboration with Samsung Electronics, has developed a breakthrough catalytic […]
Texas Instruments Introduces First Commercial CAN XL Transceiver for Robotics and Industrial Systems
Texas Instruments (TI) has announced the commercial availability of the TCAN6062, marking the industry’s first mass-market Controller Area Network Extended Data-Field Length (CAN XL) […]
Hybrid Bonding Equipment Market to Reach $924 Million by 2032
The global hybrid bonding equipment market is projected to grow from US 201millionin 2025 to US 924 million by 2032, registering a compound annual […]
Semiconductor Manufacturing Equipment Market to Reach $273 Billion by 2035
The global semiconductor manufacturing equipment market is projected to expand from $138.5 billion in 2025 to $273.0 billion by 2035, exhibiting a compound annual […]
Union Cabinet Approves Semicon 2.0 with Long-Term Policy Support
The Union Cabinet chaired by the Prime Minister Shri Narendra Modi has approved the Semicon 2.0 for the development of India’s semiconductor design and […]
Korea to Showcase Next-Generation NPU and Edge Semiconductor Technologies at IFA 2026
South Korea’s fabless and semiconductor design ecosystem is stepping onto the global stage at IFA 2026 in Berlin, Germany. Organized by the National IT […]
Manz Asia and SUSS Partner to Advance Inkjet Technology in Semiconductor Packaging
Advanced packaging equipment specialist Manz Asia has entered into a strategic collaboration with semiconductor process solutions provider SUSS to co-develop next-generation industrial inkjet printing […]
TSMC Plans Kaohsiung Hub to Speed Advanced Packaging and Testing
Taiwan Semiconductor Manufacturing Co. (TSMC) is planning to expand its footprint into the Baipu Industrial Park in Kaohsiung. The proposed project aims to accelerate […]