Cadence Design Systems has introduced the Maestro™ AI Model Portfolio, a dedicated family of specialized models developed to power Cadence® AI Super Agents across […]
Electronic component distributor Rutronik has introduced Rutronik Robotics, a targeted initiative designed to support original equipment manufacturers and system integrators developing next-generation robotics and […]
NEXCOM and its robotics subsidiary NexCOBOT have introduced the RoboWIZ AI Robotics Platform to an international audience at NVIDIA GTC Berlin, expanding their open […]
Socionext is ramping up its use of agentic artificial intelligence in the physical design flow of large system-on-chip (SoC) designs using advanced process technologies. […]
IBM has entered into a research collaboration with Siemens to accelerate the development and manufacturing readiness of its proprietary nanostack transistor architecture. The partnership […]
Siemens has expanded its collaboration with NVIDIA to accelerate computational lithography workflows by integrating NVIDIA cuLitho—a CUDA-X software library engineered for GPU-accelerated lithography—directly into […]
EHT Semi has embedded radio frequency (RF) measurement technology from Bird directly into its semiconductor power delivery platforms, including its Orion™ Direct RF™ System […]
BOS Semiconductors, a solution provider with proven expertise in Physical AI & automotive SoC technologies, will support the development of automotive chiplet interconnect technologies […]
ENCY Software and ESTUN, one of the world’s leading industrial robot manufacturers, have begun a technology partnership aimed at giving European users of ESTUN […]
Custom chip design is moving fast into autonomous machinery. SEMIFIVE, a specialist in application-specific integrated circuit (ASIC) solutions, has signed a full turnkey development […]
