BOS Semiconductors Supports MIRISE Technologies

BOS Semiconductors, a solution provider with proven expertise in Physical AI & automotive SoC technologies, will support the development of automotive chiplet interconnect technologies for MIRISE Technologies’ future mobility semiconductor innovation through a specific automotive chiplet R&D project.

BOS Semiconductors has been selected as a technology partner for MIRISE Technologies Corporation for its dedicated automotive chiplet research and prototyping project. This engagement aims to drive innovation in future automotive semiconductor by leveraging BOS Semiconductors’ proven expertise in advanced SoC technologies.

Establishing Automotive Chiplet interconnect technologies

As global interest in chiplet-based architecture continues to grow, the need for high-performance, scalable semiconductor solutions for intelligent mobility systems becomes increasingly critical. To support this evolution, MIRISE Technologies is building cutting-edge automotive chiplet interconnect technologies.

BOS Semiconductors will contribute to this research and prototyping project through its experience in automotive SoC design and modular chiplet architecture. The company’s experience in chiplet-based system design will support the development and evaluation of next-generation automotive chiplet interconnect technologies within the scope of this project.

BOS Semiconductors delivers chiplet expertise to advance the MIRISE Technologies’ project

BOS Semiconductors contributes to the MIRISE Technologies’ project through its chiplet-based design expertise, supporting the realization of next-generation automotive chiplet interconnect technologies. Beyond this project, BOS Semiconductors will continue to broaden its contributions to the global semiconductor ecosystem through its own innovation and initiatives.

“With solid experience in chiplet architecture for automotive semiconductors, BOS Semiconductors is committed to supporting MIRISE Technologies with its design capabilities and contributing to the advancement of future mobility technologies globally,” said Jaehong Park, CEO of BOS Semiconductors.

BOS Semiconductors is a South Korea–based fabless company developing Physical AI and automotive chips for vehicles, robotics, and edge devices. As the first to introduce chiplet architecture into the automotive sector, BOS Semiconductors delivers modular, power‑efficient platforms that improve yield, enable process optimization, and support customer-specific configurations. Its chiplet approach enables scalable product families tailored to diverse performance needs while enhancing flexibility and time-to-market responsiveness. The company successfully taped out its first AI accelerator in 2024, achieved functional safety certification, and secured development contracts with both domestic and European OEMs.

MIRISE Technologies, a research company on automotive semiconductors established in 2020. By combining mobility-focused expertise and in-vehicle-focused expertise, MIRISE Technologies is working toward the early research of the next generation of in-vehicle semiconductors. These semiconductors will be the key to technological innovation in electric vehicles and self-driving vehicles, from both a car and a component perspective.

Source: BOS Semiconductors