Chinese Scientists Achieve Wafer-Scale Growth of High-Performance P-Type 2D Semiconductor
In a major breakthrough for sub-5-nanometer semiconductor scaling, a research team led by Prof. REN Wencai from the Institute of Metal Research (IMR) of […]
Category: Equipment
EV Group Tackles Key Packaging Challenges for Next-Generation Co-Packaged Optics
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for semiconductor manufacturing, has announced active engagements across the rapidly growing Co-Packaged […]
Kulicke & Soffa Drives AI Infrastructure Growth with Advanced Co-Packaged Optics and Packaging Tech
Kulicke and Soffa Industries, Inc., a worldwide leader in semiconductor assembly equipment, is accelerating the expansion of next-generation computing infrastructure. As hyperscale data centers […]
Semicon 2.0 Notified: ₹1.27 Lakh Crore Push to Boost Local Chipmaking
The Union Government has officially notified the Semicon 2.0 scheme with an expanded financial outlay of ₹1.27 lakh crore. The comprehensive policy framework is […]