Odisha Gets India’s First 3D Chip Packaging Unit
In a defining moment for India’s semiconductor ambitions and Odisha’s emergence as a future-ready technology destination, the foundation stone for the country’s first advanced […]
Category: Packaging & Testing
India Targets Five Operational Semiconductor Plants by End of 2026
India is on track to operationalize five semiconductor plants by the end of 2026, marking a critical transition from pilot demonstration to industrial-scale manufacturing. […]
X-FAB Secures €127.4 Million to Build New Cleanroom in Erfurt
X-FAB MEMS Foundry GmbH has officially received a €127.4 million grant notification to expand its manufacturing infrastructure in Erfurt, Germany. Presented by Thuringia’s Minister […]
India Transitions from Fab Approvals to High-Volume Output as SEMICON India 2026 Approaches
India’s semiconductor policy framework has shifted from capital sanctioning to industrial execution, with three manufacturing units now in commercial production and additional plants slated […]
Union Cabinet Approves Semicon 2.0 with Long-Term Policy Support
The Union Cabinet chaired by the Prime Minister Shri Narendra Modi has approved the Semicon 2.0 for the development of India’s semiconductor design and […]
NITI Aayog Unveils 10-Year Semiconductor Roadmap Targeting $150 Billion Ecosystem by 2035
NITI Aayog’s Frontier Tech Hub has officially released a strategic 10-year blueprint titled “Future of India’s Semiconductor Industry,” charting an actionable pathway to establish […]
PM Modi Inaugurates CG Semi’s OSAT Facility in Sanand, Gujarat
India’s semiconductor packaging footprint marked an operational milestone as Prime Minister Narendra Modi formally inaugurated CG Semi’s Outsourced Semiconductor Assembly and Test (OSAT) facility […]
Korea to Showcase Next-Generation NPU and Edge Semiconductor Technologies at IFA 2026
South Korea’s fabless and semiconductor design ecosystem is stepping onto the global stage at IFA 2026 in Berlin, Germany. Organized by the National IT […]
Manz Asia and SUSS Partner to Advance Inkjet Technology in Semiconductor Packaging
Advanced packaging equipment specialist Manz Asia has entered into a strategic collaboration with semiconductor process solutions provider SUSS to co-develop next-generation industrial inkjet printing […]
Rockwell Automation Connects VisionAI with Plex QMS for Shop-Floor Defect Traceability
Rockwell Automation has rolled out an API-enabled integration connecting its Plex Quality Management System (QMS) directly with FactoryTalk Analytics VisionAI. The bridge links edge-level […]