Applied Materials has unveiled its Equipment and Process Innovation and Commercialization (EPIC) Center at its Sunnyvale, California campus, committing approximately $5 billion in capital […]
GlobalFoundries announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, […]
Sumitomo Bakelite Co., Ltd. has announced plans to expand its production capacity for advanced semiconductor encapsulation materials across its manufacturing sites in Suzhou, China, […]
Tessolve Semiconductor, a Hero Electronix company announced that it has secured $75 million investment from Vector Line Capital, a US-based strategic investment company that […]
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking […]
Keysight Technologies, Inc. has collaborated with the University of Glasgow, the National Physical Laboratory (NPL), and MPI Corporation to develop a new approach to […]
Bengaluru-based izmo Microsystems, the advanced semiconductor subsidiary of izmo Limited, has signed a Memorandum of Understanding with the Indian Institute of Technology Madras (IIT […]
The advanced packaging market size is expected to grow from USD 51.62 billion in 2025 to USD 57.46 billion in 2026 and is forecast […]
As the semiconductor industry scales up multi-chip architectures and larger packages, managing heat dissipation has become an urgent mechanical problem. Modern advanced packaging combines […]
SUSS MicroTec SE has announced its official entry into the wafer-level cleaning sector with the introduction of its GreenTec Solutions product line and its […]
