TSMC Plans Kaohsiung Hub to Speed Advanced Packaging and Testing
Taiwan Semiconductor Manufacturing Co. (TSMC) is planning to expand its footprint into the Baipu Industrial Park in Kaohsiung. The proposed project aims to accelerate […]
Category: Packaging & Testing
Nvidia Secures Optical Supply Chain with $2 Billion Investment in Coherent
In a definitive shift that highlights how optical interconnects are becoming the primary throttle on high-performance computing, NVIDIA Corporation has completed a $2 billion […]
Penn State and Battalion Ink $6 Million Research Deal for Extreme Materials and Semiconductors
The Pennsylvania State University and U.K.-based Battalion Advanced Technology Ltd. have entered into two major three-year research agreements valued at up to $6 million. […]
izmo Microsystems Unveils Indigenous 40 GHz RF Package for Strategic and Defence Applications
In a major boost to India’s domestic semiconductor capabilities, IZMO Limited announced that its specialized subsidiary, izmo Microsystems Pvt. Ltd., has successfully engineered an […]
EV Group Tackles Key Packaging Challenges for Next-Generation Co-Packaged Optics
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for semiconductor manufacturing, has announced active engagements across the rapidly growing Co-Packaged […]
Kulicke & Soffa Drives AI Infrastructure Growth with Advanced Co-Packaged Optics and Packaging Tech
Kulicke and Soffa Industries, Inc., a worldwide leader in semiconductor assembly equipment, is accelerating the expansion of next-generation computing infrastructure. As hyperscale data centers […]
SIA Welcomes New Federal R&D Awards to Strengthen Advanced Semiconductor Technologies
The Semiconductor Industry Association (SIA) has welcomed the announcement of seven new research and development awards granted by the CHIPS Research and Development Office […]
Semicon 2.0 Notified: ₹1.27 Lakh Crore Push to Boost Local Chipmaking
The Union Government has officially notified the Semicon 2.0 scheme with an expanded financial outlay of ₹1.27 lakh crore. The comprehensive policy framework is […]
Ashwini Vaishnaw Unveils Six Key Pillars Under Expanded Semicon 2.0
Union Minister for Electronics and Information Technology, Railways and Information & Broadcasting, Ashwini Vaishnaw addressed the media and outlined the Government’s vision for taking […]