The US Department of Commerce has announced plans to award up to $389 million in research and development funding to four domestic enterprises advancing […]
NEXCOM and its robotics subsidiary NexCOBOT have introduced the RoboWIZ AI Robotics Platform to an international audience at NVIDIA GTC Berlin, expanding their open […]
The Consortium of Electronic Industries of Karnataka (CLIK) has appointed R. Srinivasan, representing Uniq Power Solutions, as its President for the 2026–28 tenure. The […]
Samsung Electronics and SK Hynix are moving forward with major technology upgrades across their wafer fabrication plants in China, converting operational lines to produce […]
BASF has signed a Letter of Intent (LoI) with Taiwan’s Ministry of Economic Affairs (MOEA) to strengthen its long-term commitment to Taiwan’s semiconductor ecosystem. […]
A four-company joint research and development consortium led by NTT Innovative Devices Corporation has been selected under Japan’s New Energy and Industrial Technology Development […]
Shenyang Yuanda Compressor Co., Ltd. (SYCC), an operating subsidiary of Swiss reciprocating compressor specialist Burckhardt Compression, has secured multiple commercial orders for high-pressure diaphragm […]
Samsung Electro-Mechanics has entered into a strategic business partnership with NVIDIA to expand dedicated manufacturing capacity for Ajinomoto Build-up Film (ABF) package substrates, aiming […]
The SonoFlex Acoustic System from Nordson Test & Inspection has been named the recipient of the Best of West award at SEMICON West 2026. […]
Introduction The Department of Electronics and Communication Engineering (ECE), Geetanjali Institute of Technical Studies (GITS), Udaipur, successfully organized SEMIPACK 1.0 – Semiconductor Packaging International […]
