Eliyan has introduced its NuLight™ chiplet platform, presenting what it designates as the semiconductor industry’s first two-dimensional microVCSEL optical interconnect architecture. Unveiled at the […]
IBM has entered into a research collaboration with Siemens to accelerate the development and manufacturing readiness of its proprietary nanostack transistor architecture. The partnership […]
Siemens has expanded its collaboration with NVIDIA to accelerate computational lithography workflows by integrating NVIDIA cuLitho—a CUDA-X software library engineered for GPU-accelerated lithography—directly into […]
NVIDIA announced semiconductor leaders are adopting NVIDIA CUDA-X™ libraries — including the new NVIDIA cuPotential library, which developers can use to build AI agents […]
Great Lakes Semiconductor (GLS) has announced the inaugural project under its Great American ChipForge™ platform, launched via the company’s Innovation Funnel™ initiative. The development […]
FUJIFILM Corporation has announced an $18 million (approximately ¥3 billion) investment to enhance and diversify chemical mechanical planarization (CMP) slurry production at its FUJIFILM […]
EHT Semi has embedded radio frequency (RF) measurement technology from Bird directly into its semiconductor power delivery platforms, including its Orion™ Direct RF™ System […]
ERS electronic has introduced a fully automated panel-level packaging (PLP) tool engineered for 310×310mm rectangular substrates, delivering its first production unit to a tier-one […]
Tata Consultancy Services, a global leader in IT services, consulting, and business solutions, has launched the TCS Industrial Autonomy & Engineering Lab – Lights-Out […]
