Manufacturing
Wolfspeed Fixes Chip Flaws with Clean 200mm Wafers
Building high-power chips for electric cars and power grids is getting harder. As these chips grow bigger and carry more power, even tiny flaws […]
Author: Rashmi Verma
Equipment
Semicon Taiwan: TRUMPF Enables Integrated Chip Cooling for the Next Generation of AI Chips
The next generation of high-performance AI chips requires new cooling solutions. At Semicon Taiwan, TRUMPF is showcasing for the first time a new ultrashort-pulse […]
Manufacturing
VLC Photonics Moves PIC Testing and Packaging to New Valencia Site
VLC Photonics S.L., a Hitachi Group company specializing in photonic integrated circuit (PIC) design, testing, and packaging has completed the relocation of its testing […]
Manufacturing
Toshiba Introduces 3300V SiC MOSFET Module for Industrial Reliability
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, […]
Automation & Digital Factory
Logic Fruit Technologies Unveils L-QNTX Platform for Quantum-Safe Hardware Security
Deep-tech semiconductor engineering firm Logic Fruit Technologies has introduced L-QNTX™, an integrated portfolio of quantum-safe hardware security solutions designed to protect critical infrastructure, data […]
Manufacturing
Sofics Extends Interface Voltage Options in TSMC FinFET and Nanosheet Technologies
Sofics BV, a leading provider of specialty I/O and electrostatic discharge (ESD) protection IP announced the availability of its specialty I/O topologies on TSMC’s […]
Equipment
SEMICON India 2026: From Silicon to Systems, India’s Semiconductor Journey on Display
For three days, Yashobhoomi in New Delhi served as a showcase of India’s growing semiconductor capabilities. From chip design and advanced packaging to materials, […]
Infrastructure
Firefly Aerospace Completes New Cleanroom to Accelerate Spacecraft Production
Firefly Aerospace, a market leading space and defense technology company celebrated the completion of its new cleanroom facility with a ribbon cutting ceremony joined […]
Infrastructure
SES Selects ABN Cleanroom Technology to Build High-Tech Satellite Facility in Luxembourg
As the global demand for space infrastructure accelerates, the need to protect delicate space-bound electronics right from the assembly floor has never been more […]
Manufacturing
Siemens and TSMC advance AI-powered semiconductor design automation
Siemens announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement. Building on a longstanding relationship within the […]