Madhya Pradesh has secured investment proposals valued at approximately ₹5,800 crore across the semiconductor and advanced technology sectors during an industry summit in Indore. Addressing attendees ahead of the state’s Global Investors Summit scheduled for January 2027, Chief Minister Mohan Yadav confirmed that the proposed initiatives carry the potential to generate more than 10,000 direct and indirect jobs across design, component packaging, and electronics assembly lines.
The investment commitments reflect growing commercial interest in establishing integrated electronics manufacturing operations within central India. Una Ecosystems led the summit proposals with a ₹2,000-crore commitment to set up an electronics system design and manufacturing (ESDM) facility projected to generate 2,000 jobs. In core semiconductor domains, Spintronics AI Semiconductors proposed a phased ₹1,800-crore investment, while Lalwala Industries submitted a ₹1,200-crore plan dedicated to semiconductor manufacturing and integrated circuit design. Additional specialized proposals were advanced by fabless and technology firms, including ₹100 crore from Indusilica Semiconductors, ₹65 crore from Nanodrites Technology, and ₹10 crore from chip design verification specialist Truechip Solutions.
Alongside the summit proposals, the state issued letters of intent for industrial land allocation representing ₹9,625 crore in capital expenditure. These allocations support complementary digital infrastructure and manufacturing units, including a ₹6,415-crore, 50-megawatt hyperscale data centre by Cytech RE in Gwalior, a ₹500-crore global capability centre by Auriga IT Solutions in Indore, and dedicated electronics manufacturing plants from Meena Circuits and Kaynes Electronics in Bhopal.
These projects reinforce earlier momentum generated by Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, which signed a memorandum of understanding in July 2026 to commit approximately ₹6,200 crore toward a greenfield outsourced semiconductor assembly and test (OSAT) facility. The state administration has designated the Indore-Ujjain Economic Corridor as a focal hub for advanced packaging, wafer bumping, chip design, and electronic subsystems, backed by dedicated infrastructure initiatives including a Semiconductor Centre of Excellence and a Centre of Excellence for Photonics and Quantum Technologies.
Underpinning these industrial commitments is the Madhya Pradesh Semiconductor Policy 2025. To reduce high front-end capital intensity for cleanrooms and automated packaging tools, the policy offers eligible projects capital expenditure subsidies equal to 25 per cent of eligible capex or 50 per cent of central incentives under the India Semiconductor Mission, alongside a 10-year power tariff subsidy of ₹2 per unit and interest subsidies. For fabless design firms, the framework provides development expense reimbursements up to ₹25 crore aligned with the central Design Linked Incentive scheme. By combining targeted fiscal subsidies with reliable utility tariffs and infrastructure corridors, Madhya Pradesh is positioning itself to capture critical midstream assembly, testing, and design nodes within India’s expanding microelectronics supply chain.
