ERS electronic has introduced a fully automated panel-level packaging (PLP) tool engineered for 310×310mm rectangular substrates, delivering its first production unit to a tier-one […]
EHT Semi has embedded radio frequency (RF) measurement technology from Bird directly into its semiconductor power delivery platforms, including its Orion™ Direct RF™ System […]
GlobalFoundries announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS® advanced packaging ecosystem. Under the agreement, […]
Pakal Technologies Inc., the company behind the creation of the Insulated Gate Turn-Off Thyristor (IGTO), which is a new generation and highly efficient silicon […]
VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors, has officially opened its first 12-inch (300mm) […]
The PORR Group will build a new semiconductor manufacturing plant for X-FAB in the city of Erfurt, Germany. The planned plant has been named […]
Both Intel Foundry and ASML have recently made important announcements during the SPIE Photomask Technology + Extreme Ultraviolet Lithography event about their plans for […]
