Advanced packaging equipment specialist Manz Asia has entered into a strategic collaboration with semiconductor process solutions provider SUSS to co-develop next-generation industrial inkjet printing […]
Rockwell Automation has rolled out an API-enabled integration connecting its Plex Quality Management System (QMS) directly with FactoryTalk Analytics VisionAI. The bridge links edge-level […]
Taiwan Semiconductor Manufacturing Co. (TSMC) is planning to expand its footprint into the Baipu Industrial Park in Kaohsiung. The proposed project aims to accelerate […]
In a definitive shift that highlights how optical interconnects are becoming the primary throttle on high-performance computing, NVIDIA Corporation has completed a $2 billion […]
The Pennsylvania State University and U.K.-based Battalion Advanced Technology Ltd. have entered into two major three-year research agreements valued at up to $6 million. […]
In a major boost to India’s domestic semiconductor capabilities, IZMO Limited announced that its specialized subsidiary, izmo Microsystems Pvt. Ltd., has successfully engineered an […]
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for semiconductor manufacturing, has announced active engagements across the rapidly growing Co-Packaged […]
Kulicke and Soffa Industries, Inc., a worldwide leader in semiconductor assembly equipment, is accelerating the expansion of next-generation computing infrastructure. As hyperscale data centers […]
The Semiconductor Industry Association (SIA) has welcomed the announcement of seven new research and development awards granted by the CHIPS Research and Development Office […]
The Union Government has officially notified the Semicon 2.0 scheme with an expanded financial outlay of ₹1.27 lakh crore. The comprehensive policy framework is […]
