The Pennsylvania State University and U.K.-based Battalion Advanced Technology Ltd. have entered into two major three-year research agreements valued at up to $6 million. […]
In a major breakthrough for sub-5-nanometer semiconductor scaling, a research team led by Prof. REN Wencai from the Institute of Metal Research (IMR) of […]
Nexperia B.V. and Aurobay Technologies a powertrain division under Horse Powertrain Ltd (a Renault Group and Geely joint venture) are exploring a strategic co-engineering […]
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for semiconductor manufacturing, has announced active engagements across the rapidly growing Co-Packaged […]
Japan-based Sumitomo Chemical Co., Ltd. has officially started mass production of four-inch Indium Phosphide (InP) epitaxial wafers, aiming to address the fast-growing hardware demands […]
Swedish deep-tech firm TekSiC AB has announced significant technological progress in manufacturing semi-insulating silicon carbide (SI-SiC) wafers, marking an important step toward establishing a […]
