VLC Photonics Moves PIC Testing and Packaging to New Valencia Site
VLC Photonics S.L., a Hitachi Group company specializing in photonic integrated circuit (PIC) design, testing, and packaging has completed the relocation of its testing […]
Category: Manufacturing
Toshiba Introduces 3300V SiC MOSFET Module for Industrial Reliability
Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has expanded its lineup with the launch of “IX800FXF2YMS4,” a dual SiC MOSFET module for industrial equipment, […]
Logic Fruit Technologies Unveils L-QNTX Platform for Quantum-Safe Hardware Security
Deep-tech semiconductor engineering firm Logic Fruit Technologies has introduced L-QNTX™, an integrated portfolio of quantum-safe hardware security solutions designed to protect critical infrastructure, data […]
Sofics Extends Interface Voltage Options in TSMC FinFET and Nanosheet Technologies
Sofics BV, a leading provider of specialty I/O and electrostatic discharge (ESD) protection IP announced the availability of its specialty I/O topologies on TSMC’s […]
SEMICON India 2026: From Silicon to Systems, India’s Semiconductor Journey on Display
For three days, Yashobhoomi in New Delhi served as a showcase of India’s growing semiconductor capabilities. From chip design and advanced packaging to materials, […]
Siemens and TSMC advance AI-powered semiconductor design automation
Siemens announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement. Building on a longstanding relationship within the […]
Nexstrom Raises $12M to Scale 12-Inch 2D Semiconductor Wafer Manufacturing
Singapore-based semiconductor startup Nexstrom has secured a US$12 million (RM49 million) seed funding round led by deep-tech investor Xora Innovation, with participation from Foothill […]
Anderon Finalizes $1B CHIPS Award for U.S. Quantum Foundry R&D
Anderon LLC (“Anderon”), an IBM company, announced the finalization of a $1 billion award under the CHIPS and Science Act with the U.S. Department […]
imec IC-Link and TSMC Expand Silicon Design Alliance
Translating a breakthrough silicon architecture into physical, manufacturable wafers is becoming one of the most resource-draining phases in semiconductor development. At deep-submicron geometries, chip […]
Cognex Launches In-Sight 1750 to Tackle Wafer Traceability Bottlenecks in Semiconductor Fabs
As global semiconductor fabrication facilities accelerate capital expenditures to meet surging demand for high-performance computing, cleanroom operations face an intensifying operational challenge: microscopic-level lot […]