South Korean electronic materials specialist Ace nanochem Co., Ltd. has completed the development of three specialized materials solutions engineered for front-end fabrication and backend packaging lines. The portfolio expansion comprises a polysilicon (Poly-Si) chemical mechanical polishing (CMP) slurry tailored for power trench MOSFET architectures, a post-CMP surface treatment formulation for bare silicon wafers, and a multi-material CMP slurry engineered for glass through-glass via (TGV) manufacturing. With commercial development concluded, the company is preparing to leverage these formulations to accelerate engagements with leading semiconductor manufacturers and foundries across Taiwan and Japan.
In discrete power device fabrication, trench MOSFETs require strict process control during gate formation. Etching deep trenches and refilling them with polysilicon necessitates aggressive CMP planarization to eliminate surface topography without eroding the critical gate oxide layer underneath. Ace nanochem’s Poly-Si slurry is formulated to deliver elevated polysilicon removal rates while preserving gate oxide integrity. By mitigating surface defects such as micro-scratches, particulate residue, dishing, and dielectric erosion, the slurry stabilizes wafer surface uniformity and tightens process margins across high-voltage power device manufacturing.
Addressing front-end substrate preparation, the company has introduced a dedicated silicon bare wafer surface treatment agent. Applied immediately following chemical mechanical polishing, the chemical formulation modifies substrate wettability to suppress post-polishing particulate adhesion and chemical contamination. Maintaining strict surface cleanliness at this juncture prevents defect propagation into subsequent high-temperature diffusion, epitaxial growth, and photolithography sequences.
For backend manufacturing, the third solution targets the emerging adoption of glass core substrates in heterogeneous integration. Processing through-glass vias presents complex planarization challenges because the tool must simultaneously polish materials with radically disparate mechanical hardness and removal rates, namely bulk copper metallization, barrier metals, and brittle glass. Ace nanochem’s glass TGV slurry is specifically engineered to balance removal selectivity across these multi-material stacks, preventing severe step-height variations, copper dishing, or substrate chipping, thereby securing the planarity required for fine-pitch redistribution layers.
Jonghoon Lee, Chief Executive Officer of Ace nanochem, stated that the three material solutions illustrate the company’s technical focus on addressing demanding fabrication steps spanning power semiconductors to advanced multi-die packaging. He emphasized that the company intends to build upon its domestic manufacturing capabilities to deepen joint technical development with chipmakers in Taiwan, Japan, and other international markets.
The initiative highlights the strategic role of upstream consumable chemistry in enabling packaging and power semiconductor roadmaps. Having supplied domestic chipmakers in South Korea, Ace nanochem is expanding technical collaborations with merchant foundries through regular participation in SEMICON Taiwan. As the global industry scales glass substrates and high-efficiency power architectures, qualified chemical formulations remain critical to sustaining commercial fabrication yields.
