RRP Electronics Ltd. has inaugurated a new Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor manufacturing unit in Navi Mumbai, Maharashtra, on October 12, 2026, expanding its Outsourced Semiconductor Assembly and Test (OSAT) capabilities and strengthening India’s semiconductor manufacturing ecosystem.
The facility was inaugurated by Uday Samant, Maharashtra’s Cabinet Minister for Industries and Marathi Language, alongside Dr. Anil Kakodkar, Dr. G. Satheesh Reddy, and Rajendra Chodankar, Chairman of RRP Electronics Ltd.
The new facility expands the company’s semiconductor packaging portfolio beyond conventional technologies, including Quad Flat No-lead (QFN) packaging, into advanced wafer-level packaging, specialised connectivity modules and high-performance semiconductor applications.
AWLP enables integrated circuits to be packaged and interconnected at the wafer level before individual chips are separated. The technology supports compact device designs and increasingly complex electronic applications as semiconductor manufacturers seek improved integration and performance amid the rising costs of transistor miniaturisation.
RRP Electronics plans to use the facility for wire-bonded and flip-chip-bonded SIM modules, eSIMs, embedded connectivity modules, and advanced semiconductor packages. These capabilities are intended to serve telecommunications and electronics manufacturers requiring compact, secure and highly integrated connectivity solutions.
The company is also strengthening its semiconductor testing infrastructure to support specialised devices, including Monolithic Microwave Integrated Circuits (MMICs). Used in radar, communications and other high-frequency electronic systems, MMICs require specialised packaging and testing capabilities. The expansion could help RRP Electronics address requirements across telecommunications, industrial, automotive, defence and strategic electronics.
By integrating AWLP with its existing OSAT operations, the company aims to offer a broader manufacturing platform spanning packaging, assembly, testing and module manufacturing. This expansion represents a further step towards developing integrated semiconductor manufacturing capabilities within India.
Commenting on the development, Chodankar said the facility marks an important milestone in the company’s semiconductor journey. He highlighted its progression from conventional QFN packaging to advanced wafer-level packaging, SIM/eSIM modules and specialised testing, with plans to continue expanding its manufacturing capabilities.
The investment reflects RRP Electronics’ broader ambition to strengthen its position in India’s semiconductor value chain. By adding advanced packaging and specialised module manufacturing to its existing capabilities, the company aims to address evolving customer requirements and contribute to the country’s domestic semiconductor manufacturing ecosystem.
