VisionPower Semiconductor Manufacturing Company (VSMC), a joint venture between Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors, has officially opened its first 12-inch (300mm) wafer fab in Tampines, Singapore. The facility marks a significant step forward in building global supply chain resilience for essential specialty chips.
The grand opening was attended by government and industry leaders, including Dr. Tan See Leng, Singapore’s Minister for Trade and Industry; Mr. Png Cheong Boon, Chairman of the Singapore Economic Development Board (EDB); and Ms. Jacqueline Poh, CEO of JTC Corporation. Representatives from TSMC, partner firms, suppliers, and customers joined the celebration alongside the leadership teams of VIS, NXP, and VSMC.
Following 22 months of construction since breaking ground in December 2024, the newly finished facility has entered its risk production phase. The fab has already processed its first sample lot with yields exceeding 99%. Full-scale commercial volume production is on track to kick off in the first quarter of 2027.
The site is designed to manufacture specialty chips across 130nm to 40nm nodes. These process technologies will support mixed-signal devices, power management ICs, analog solutions, and interposers. These components serve critical growth sectors, including automotive, high-performance computing, mobile devices, industrial equipment, and smart consumer electronics.
The facility runs on a fully automated smart manufacturing model, applying artificial intelligence and real-time digital factory management across cleanroom lines to optimize yield and tool performance. At full capacity in 2029, the plant will produce around 44,000 12-inch wafers per month and create approximately 1,600 high-skilled local jobs.
VSMC and VIS Chairman Leuh Fang emphasized that the milestone strengthens VIS’s presence in Singapore while meeting rising customer demand for specialty IC manufacturing. Rafael Sotomayor, President and CEO of NXP, highlighted that the fab reinforces NXP’s hybrid manufacturing strategy, cost competitiveness, and geographic supply resilience. He added that the output will deliver the core technologies needed to power intelligent edge hardware and physical AI systems.
Ms. Cindy Koh, Executive Vice President of the Singapore EDB, noted that the project reflects ongoing global confidence in Singapore as a premier advanced manufacturing hub. She commended VSMC’s workforce development partnerships and its focus on sustainable operations.
Built to meet LEED and Singapore Green Mark environmental benchmarks, the facility integrates renewable power, water recycling systems, and carbon abatement technologies. To develop future semiconductor engineers, VSMC has also signed agreements with leading universities across Singapore to provide specialized internships and industrial training.
