Manufacturing
GUC Delivers 16 Gbps HBM4E PHY on TSMC N2P Process and CoWoS-L
Global Unichip Corp. (GUC) has confirmed that its High Bandwidth Memory 4E (HBM4E) Physical Layer (PHY) and Controller IP is silicon-ready, securing immediate adoption […]
Tag: High Bandwidth Memory
Automation & Digital Factory
Samsung and Mistral Partner to Modernize Fab Operations and Silicon Engineering
Samsung Electronics has entered a strategic technology partnership with Mistral to integrate specialized computational infrastructure across its semiconductor engineering and manufacturing lines. Formalized during […]
Manufacturing
Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure
Samsung Electronics Co., Ltd., a global leader in advanced memory technology showcased its latest AI memory innovations at Future of Memory and Storage (FMS) […]
Equipment
Hybrid Bonding Equipment Market to Reach $924 Million by 2032
The global hybrid bonding equipment market is projected to grow from US 201millionin 2025 to US 924 million by 2032, registering a compound annual […]
Equipment
Kulicke & Soffa Drives AI Infrastructure Growth with Advanced Co-Packaged Optics and Packaging Tech
Kulicke and Soffa Industries, Inc., a worldwide leader in semiconductor assembly equipment, is accelerating the expansion of next-generation computing infrastructure. As hyperscale data centers […]