Entegris, Inc., a supplier of advanced materials and process solutions for the semiconductor and high-technology industries, has announced two strategic milestones aimed at expanding its presence in silicon carbide (SiC) and diamond-enabled thermal management solutions for next-generation AI advanced packaging.
The move comes as growing demand for artificial intelligence (AI) computing, including model training and inference, increases power consumption and heat-management requirements in data centres. As semiconductor devices become more powerful and advanced packaging architectures grow increasingly complex, effective thermal management is emerging as a critical requirement for maintaining chip performance and reliability.
As part of its expansion strategy, Entegris has completed the acquisition of Advanced Abrasives Corporation, a New Jersey-based specialist in diamond-made precision super-abrasive consumables used in hard-substrate polishing processes.
The acquisition strengthens Entegris’ existing chemical mechanical planarisation (CMP) capabilities for SiC, which include slurries, polishing pads, cleaning solutions and surface conditioning technologies. It also expands the company’s intellectual property portfolio in materials science and surface engineering.
Following the acquisition and strong engagement with customers, Entegris plans to invest in a new manufacturing line in Taiwan to support the commercialisation of its SiC solutions. The company will also continue exploratory research and development activities in the United States, focusing on next-generation thermal interface materials.
The second milestone involves a long-term development partnership with Element Six, a global synthetic diamond technology company and part of De Beers Group. The collaboration aims to accelerate the integration of diamond-enabled thermal management solutions into advanced semiconductor packaging.
The partnership will focus on developing scalable and cost-effective wafer-level and heterogeneous integration approaches. These technologies are intended to reduce manufacturing complexity, minimise thermal boundary resistance and address the performance requirements of next-generation logic and memory chips, including those using three-dimensional (3D) integration architectures.
According to Olivier Blachier, President, Materials Solution and SVP, Chief Innovation Officer at Entegris, the increasing computational demands of AI are creating new requirements for materials innovation at both chip and package levels.
Blachier noted that the semiconductor industry is approaching a shift from conventional heat-spreading materials towards advanced materials and engineered thermal interfaces. Entegris aims to support this transition by enabling improved heat dissipation without compromising device performance or reliability.
Through the acquisition and strategic partnership, Entegris is strengthening its materials capabilities across SiC processing and diamond-based thermal management. The initiatives position the company to address emerging thermal challenges in AI-driven semiconductor manufacturing and advanced packaging.
