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SK keyfoundry and Elmos Expand Automotive Chip Partnership with Long-Term 130nm Deal

SK keyfoundry and Elmos Expand Automotive Chip Partnership with Long-Term 130nm Deal

South Korean 8-inch pure-play foundry SK keyfoundry has signed a comprehensive agreement with Germany-based Elmos Semiconductor SE to expand their manufacturing collaboration to the 130nm node. Formalized in Frankfurt am Main, the long-term contract secures dedicated wafer capacity for Elmos through 2037, extending an 18-year manufacturing relationship originally built on 350nm technology.

Advancing Mixed-Signal Integration with Deep-Trench Isolation

The migration from mature 350nm lithography to a specialized 130nm mixed-signal process addresses the automotive industry’s shift toward higher functional density and stringent power constraints. A core technical highlight of SK keyfoundry’s 130nm platform is the integration of deep-trench isolation (DTI).

In high-voltage mixed-signal automotive ICs, parasitic substrate currents and thermal cross-talk between high-power switching stages and sensitive low-noise analog control circuitry often degrade performance. DTI introduces physical dielectric barriers that etched deep into the silicon substrate, offering robust electrical isolation. This structure suppresses parasitic latch-up, cuts substrate leakage currents, and permits dense co-integration of high-voltage drivers with precise analog and logic blocks on a single die.

Powering Zonal Architectures: eFuse and Embedded Flash

The first commercial device built on this 130nm platform is Elmos’ E550.01, a smart 4-channel electronic fuse (eFuse) controller scheduled for full-scale mass production in 2027. As automotive wiring harnesses transition from bulky centralized domain architectures to distributed zonal controllers, intelligent solid-state eFuses replace electromechanical relays and melt fuses. The E550.01 provides real-time current sensing, transient fault isolation, and configurable power path management across multiple vehicle loads.

Alongside power management, the partners are co-developing a compact, power-efficient embedded Flash (eFlash) memory cell. Integrating non-volatile memory directly into the 130nm mixed-signal process allows microcontroller and driver ICs to store calibration data, security keys, and firmware without external memory chips, reducing board footprints and bill-of-materials costs.

Securing Automotive Supply Stability

Automotive design cycles operate on extended qualification timelines, requiring process consistency and guaranteed supply across multi-year vehicle production runs. For Elmos, reserving dedicated capacity on SK keyfoundry’s 200mm lines through 2037 provides long-range operational visibility amid fluctuating global semiconductor foundry utilization.For SK keyfoundry, the multi-decade agreement anchors steady automotive revenue while scaling its specialized legacy foundry portfolio into safety-critical automotive power and actuation systems.

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