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Kaynes Semicon Partners with Haryana Government to Setup ₹500 Crore Advanced Manufacturing Facility

Kaynes Semicon Partners with Haryana Government to Setup ₹500 Crore Advanced Manufacturing Facility

Kaynes Semicon is all set to take a major step towards boosting its indigenous semiconductor and electronics industry in India by signing an MoU with the Haryana Enterprises Promotion Centre (HEPC), Department of Industries and Commerce, Government of Haryana.

The signing of the MoU took place during a very crucial meeting that was held at The Leela Gandhinagar.

According to the terms of the MoU, Kaynes Semicon will invest around ₹500 crores in Haryana in order to establish its state-of-the-art manufacturing facility. Apart from this, the expansion will provide employment to around 1,000 people in the form of technicians, engineers, and operation managers.

In order to ensure a smooth set-up and start-up of the business operations, the Haryana government will offer complete assistance through their one-stop facilitation portal and Ease of Doing Business concept.

In addition to that, after extensive talks held with the Hon’ble Chief Minister of Haryana, Mr. Nayab Singh Saini, Kaynes Semicon was officially invited by the Hon’ble CM, to be a part of the happening Haryana Global Investors Summit to be organized in April 2027. This forum will be a great opportunity for the firm to engage in technology partnerships, capital investments and research and development activities in line with the vision of Viksit Bharat.

The industry leaders consider this public-private partnership as an essential roadmap towards the realization of India’s semiconductor dreams. The creation of an effective and competitive semiconductor supply chain is largely dependent on the efficient coordination between innovative technology companies and state governments to provide large-scale power, logistics, and human resources. Kaynes Semicon reaffirmed its dedication to shaping the future of India’s industries through cutting-edge technologies.

About the Author

Vaishali Chauhan

Sub-Editor

A journalism professional passionate about semiconductor technology, innovation, and industry storytelling. Focuses on covering the developments shaping the global and Indian semiconductor landscape, including chip manufacturing, fabrication infrastructure, semiconductor equipment, advanced packaging and testing, and supply chain advancements. Through industry news, interviews, and editorial features, aims to highlight breakthroughs, business developments, and emerging opportunities across the semiconductor value chain. Committed to making semiconductor industry developments accessible to readers while exploring the technologies, investments, and innovations driving chip design, manufacturing capabilities, and the evolution of the semiconductor ecosystem.

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