Rapidus Corporation announced the launch of the Rapidus Collaborative Open Rapid Ecosystem (CORE), a comprehensive global initiative designed to support the development and mass production of next-generation semiconductors.
As chip architectures grow increasingly complex, modern semiconductor development demands far more than standalone fabrication capabilities. Delivering reliable infrastructure requires seamless integration across the entire semiconductor value chain—encompassing research institutes, electronic design automation (EDA), intellectual property (IP) providers, design houses, and foundries.
At the same time, the industry faces an acute worldwide shortage of specialized engineering talent. To tackle these hurdles, Rapidus is establishing an open ecosystem that empowers customers to kick off development early and streamline the path from architectural design to final silicon.
As the inaugural step under the Rapidus CORE framework, the company revealed the formation of “Design Solution Associates”—a consortium of 17 specialized design service providers. This coalition will act as a direct bridge between global customers and Rapidus, contributing specialized engineering expertise, specialized IP integration, and front-to-back design resources.
The initial lineup of 17 Design Solution Associates features leading international and Japanese technology firms, including: AION Silicon Limited, Cadence Design Systems, Inc., Dai Nippon Printing Co., Ltd., GreatAsic Technology Sdn. Bhd., HCL Technologies Limited, Infinecs Systems Sdn. Bhd., Infosys Limited, MavissDesign Co., Ltd., MosChip Technologies Limited, NSW Inc., Oppstar Technology Sdn Bhd, Quest Global Services Pte. Ltd., SkyeChip Berhad, Synopsys, Inc., TOPPAN Inc., Toshiba Information Systems (Japan) Corporation, and Wipro Limited.
This collaborative network strengthens Rapidus’s end-to-end support model for clients in Japan and worldwide. Looking ahead, Rapidus plans to broaden the CORE network beyond design services to incorporate leading EDA vendors, IP developers, and manufacturing specialists.
The timing is critical as rapid advances in artificial intelligence, high-performance computing, and edge processing require ever-faster innovation cycles and power-efficient silicon architectures. By uniting key industry leaders under one banner, Rapidus aims to ease supply chain bottlenecks, accelerate time-to-market for cutting-edge nodes, and foster a robust foundation for next-generation semiconductor manufacturing worldwide.
